2,2'-Diallyl bisphenol A diacetate ether
Product Information
Molecular Formula
C25H28O4
Molecular Weight
392.49
Description
Epoxy curative with good thermal properties.• Stable• Low viscosity• Does not impede free radical cure• Thermoset adhesives• Curative for epoxy/(meth) acrylate hybrids• Hybrid epoxy/free radical thermosets
Synonyms
EC-392,Phenyl ester epoxy curative hybrid of bisphenol A
IUPAC Name
[4-[2-(4-acetyloxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenyl] acetate
SMILES
CC(=O)OC1=C(C=C(C=C1)C(C)(C)C2=CC(=C(C=C2)OC(=O)C)CC=C)CC=C
InChI
InChI=1S/C25H28O4/c1-7-9-19-15-21(11-13-23(19)28-17(3)26)25(5,6)22-12-14-24(29-18(4)27)20(16-22)10-8-2/h7-8,11-16H,1-2,9-10H2,3-6H3
InChI Key
GJTZQXNRNNDGRG-UHFFFAOYSA-N
Boiling Point
158 °C/17 mmHg(lit.)
Flash Point
>230 °F
Purity
90%
Density
1.096 g/mL at 25 °C
Appearance
liquid
Storage
2-8°C
Refractive Index
n20/D 1.548
Safety Information
Hazards
H315 - H317 - H319 - H335
Precautionary Statement
P280 - P302 + P352 - P305 + P351 + P338
Computed Properties
XLogP3
6.4
Hydrogen Bond Donor Count
0
Hydrogen Bond Acceptor Count
4
Rotatable Bond Count
10
Exact Mass
392.19875937 g/mol
Monoisotopic Mass
392.19875937 g/mol
Topological Polar Surface Area
52.6Ų
Heavy Atom Count
29
Formal Charge
0
Complexity
544
Isotope Atom Count
0
Defined Atom Stereocenter Count
0
Undefined Atom Stereocenter Count
0
Defined Bond Stereocenter Count
0
Undefined Bond Stereocenter Count
0
Covalently-Bonded Unit Count
1
Compound Is Canonicalized
Yes
Patents
| Publication Number | Title | Priority Date |
|---|---|---|
| EP-3492444-A1 | Methods of making stable and thermally polymerizable vinyl, amino or oligomeric phenoxy benzocyclobutene monomers with improved curing kinetics | 2017-12-01 |
| US-10513568-B2 | Methods of making stable and thermally polymerizable vinyl, amino or oligomeric phenoxy benzocyclobutene monomers with improved curing kinetics | 2017-12-01 |
| US-2019169327-A1 | Methods of making stable and thermally polymerizable vinyl, amino or oligomeric phenoxy benzocyclobutene monomers with improved curing kinetics | 2017-12-01 |
| US-2020087429-A1 | Methods of making stable and thermally polymerizable vinyl, amino or oligomeric phenoxy benzocyclobutene monomers with improvied curing kinetics | 2017-12-01 |
| EP-3492444-B1 | Methods of making stable and thermally polymerizable vinyl, amino or oligomeric phenoxy benzocyclobutene monomers with improved curing kinetics | 2017-12-01 |
| EP-3708559-A1 | Methods of making stable and thermally polymerizable vinyl, amino or oligomeric phenoxy benzocyclobutene monomers with improved curing kinetics | 2017-12-01 |
| US-2020165275-A1 | Compound having alkoxysilyl group and active ester group, method for preparing same, composition comprising same, and use | 2017-06-05 |
| US-2012279697-A1 | Thermal interface material with phenyl ester | 2009-11-13 |
| WO-2011059942-A2 | Thermal interface material with phenyl ester | 2009-11-13 |
| US-2013199724-A1 | Curatives for epoxy compositions | 2009-10-09 |
