2-Nitro-p-xylylene glycol
Product Information
Molecular Formula
C8H9NO4
Molecular Weight
183.161
Description
As an antibacterial agent, 2-Nitro-p-xylylene glycol can effectively inhibit the proliferation of harmful bacterial and fungal species, and can be used in the development of drugs to combat occult skin infections caused by bacteria or fungi.
Synonyms
(2-Nitro-1,4-phenylene)dimethanol; 2-Nitro-p-xylene-alpha,alpha'-diol; 1,4-benzenedimethanol, 2-nitro-; [4-(hydroxymethyl)-3-nitrophenyl]methanol; 2-Nitro-1,4-benzenedimethanol; 1,4-Benzenedimethanol,2-nitro-; (2-nitrobenzene-1,4-diyl)dimethanol; 2-Nitro-p-xylylene Glycol, >/=95%; p-Xylene-alpha,alpha'-diol, 2-nitro-
IUPAC Name
[4-(hydroxymethyl)-3-nitrophenyl]methanol
SMILES
C1=CC(=C(C=C1CO)[N+](=O)[O-])CO
InChI
InChI=1S/C8H9NO4/c10-4-6-1-2-7(5-11)8(3-6)9(12)13/h1-3,10-11H,4-5H2
InChI Key
KWVHOBYJXDKIPL-UHFFFAOYSA-N
Melting Point
95 °C
Purity
>95.0%(GC)
Computed Properties
XLogP3
0
Hydrogen Bond Donor Count
2
Hydrogen Bond Acceptor Count
4
Rotatable Bond Count
2
Exact Mass
183.05315777 g/mol
Monoisotopic Mass
183.05315777 g/mol
Topological Polar Surface Area
86.3Ų
Heavy Atom Count
13
Formal Charge
0
Complexity
180
Isotope Atom Count
0
Defined Atom Stereocenter Count
0
Undefined Atom Stereocenter Count
0
Defined Bond Stereocenter Count
0
Undefined Bond Stereocenter Count
0
Covalently-Bonded Unit Count
1
Compound Is Canonicalized
Yes
Patents
| Publication Number | Title | Priority Date |
|---|---|---|
| JP-2018060205-A | Photosensitive resin composition, method for producing cured relief pattern, semiconductor device and display device | 2017-11-06 |
| JP-6454769-B2 | Photosensitive resin composition, method for producing cured relief pattern, semiconductor device and display device | 2017-11-06 |
| JP-2019059915-A | Surface treatment composition, method for producing the same, and surface treatment method using the same | 2017-09-26 |
| KR-20190035490-A | Surface treatment composition, preparation method thereof, surface treatment method using the same | 2017-09-26 |
| US-2019093051-A1 | Surface treatment composition, preparation method thereof, surface treatment method using the same | 2017-09-26 |
| US-10858615-B2 | Surface treatment composition, preparation method thereof, surface treatment method using the same | 2017-09-26 |
| JP-2018160665-A | Semiconductor device and manufacturing method thereof | 2017-03-22 |
| TW-I691525-B | Semiconductor device and its manufacturing method | 2017-03-22 |
| JP-2018155938-A | Photosensitive resin composition, semiconductor device manufacturing method, resin film, cured resin film, and semiconductor device | 2017-03-17 |
| JP-2021113993-A | Photosensitive resin composition, manufacturing method of semiconductor device, resin film, cured resin film, and semiconductor device | 2017-03-17 |
