4,4'-Bis(4-aminophenoxy)biphenyl

Inquiry

Molecular Formula:

C24H20N2O2

Molecular Weight:

368.43

CAS Number:

13080-85-8

Catalog Number:

13080-85-8

Product Information

Molecular Formula:

C24H20N2O2

Molecular Weight:

368.43

Description

Applications: 4,4'-BIS(4-AMINOPHENOXY)BIPHENYL is a useful research chemical.

Synonyms

4,4'-(1,1'-BIPHENYL-4,4'-DIYLDIOXY)DIANILINE; 4,4'-(P-BIPHENYLENEDIOXY)DIANILINE; 4,4'-BIS(4-AMINOPHENOXY)BIPHENYL; BAPB; 4,4-BIS(4-AMINOPHENOXY)BIPHENYL(44BAPOBP) 98%; 4,4'-Bis(4-aminophenoxy)biphenyl

IUPAC Name

4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline

Canonical SMILES

C1=CC(=CC=C1C2=CC=C(C=C2)OC3=CC=C(C=C3)N)OC4=CC=C(C=C4)N

InChI

InChI=1S/C24H20N2O2/c25-19-5-13-23(14-6-19)27-21-9-1-17(2-10-21)18-3-11-22(12-4-18)28-24-15-7-20(26)8-16-24/h1-16H,25-26H2

InChI Key

HYDATEKARGDBKU-UHFFFAOYSA-N

Boiling Point

571.4°C at 760mmHg

Melting Point

197-200°C

Purity

>97.0%(T)

Density

197-200°C(lit.)

Appearance

White to Gray to Red powder to crystal

Safety Information

Hazards

H315:
Causes skin irritation.
H319:
Causes serious eye irritation.

Precautionary Statement

P264:
Wash thoroughly after handling.
P280:
Wear protective gloves/protective clothing/eye protection/face protection.
P302+P352:
IF ON SKIN:
Wash with plenty of soap and water.
P332+P313:
If skin irritation occurs:
Get medical advice/attention.
P337+P313:
If eye irritation persists:
Get medical advice/attention.
P362+P364:
Take off contaminated clothing. [As modified by IV ATP].
And wash it before reuse. [Added by IV ATP].

Computed Properties

XLogP3

4.4

Hydrogen Bond Donor Count

Hydrogen Bond Acceptor Count

Rotatable Bond Count

Exact Mass

368.152477885 g/mol

Monoisotopic Mass

368.152477885 g/mol

Topological Polar Surface Area

70.5Å²

Heavy Atom Count

Formal Charge

Complexity

400

Isotope Atom Count

Defined Atom Stereocenter Count

Undefined Atom Stereocenter Count

Defined Bond Stereocenter Count

Undefined Bond Stereocenter Count

Covalently-Bonded Unit Count

Compound Is Canonicalized

Yes

Patents

Publication Number	Title	Priority Date
JP-2022040214-A	Resin composition	2022-01-05
JP-2022043096-A	Resin composition, method for manufacturing cured relief pattern, and semiconductor device	2021-12-01
CN-113999527-A	Resin composition, composite resin, and preparation and application thereof	2021-11-25
JP-2022022261-A	Resin composition	2021-11-22
CN-114085378-A	Polyamide acid solution and preparation method thereof, polyimide film and preparation method and application thereof	2021-11-16
JP-2022017350-A	Adhesive sheet with support	2021-10-19
CN-113773540-A	Polyimide film, preparation method and application thereof	2021-09-28
JP-2022000518-A	Polyimide and polyimide precursor	2021-09-17
CN-113667303-A	Resin composition and application thereof	2021-08-20
CN-113403021-A	Composition slurry, preparation method thereof and film	2021-07-13

Literatures

PMID	Publication Date	Title	Journal
16108442	2005-07-01	Effect of heterocyclic based organoclays on the properties of polyimide-clay nanocomposites	Journal of nanoscience and nanotechnology

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