5,5-(Hexafluoroisopropylidene)di-o-toluidine

Inquiry

Molecular Formula:

C17H16F6N2

Molecular Weight:

362.31

CAS Number:

116325-74-7

Catalog Number:

116325-74-7

Product Information

Molecular Formula:

C17H16F6N2

Molecular Weight:

362.31

Description

5,5-(Hexafluoroisopropylidene)di-o-toluidine is an indispensable entity within the realm of biomedical applications. Its can facilitate the meticulous design and amalgamation of diverse pharmacological agents and intricately structured organic molecules. By virtue of its unrivaled prowess, this compound emerges as an indispensable player in the intricate domain of disease treatment and regulation, orchestrating the synthesis of precisely tailored therapeutics boasting targeted efficacy.

Synonyms

116325-74-7; 2,2-Bis(3-amino-4-methylphenyl)hexafluoropropane; 5,5'-(Hexafluoroisopropylidene)di-o-toluidine; 5,5'-(Perfluoropropane-2,2-diyl)bis(2-methylaniline); 5-[2-(3-amino-4-methylphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-methylaniline; ST50997708

IUPAC Name

5-[2-(3-amino-4-methylphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-methylaniline

Canonical SMILES

CC1=C(C=C(C=C1)C(C2=CC(=C(C=C2)C)N)(C(F)(F)F)C(F)(F)F)N

InChI

InChI=1S/C17H16F6N2/c1-9-3-5-11(7-13(9)24)15(16(18,19)20,17(21,22)23)12-6-4-10(2)14(25)8-12/h3-8H,24-25H2,1-2H3

InChI Key

HJSYPLCSZPEDCQ-UHFFFAOYSA-N

Boiling Point

377.4ºC at 760mmHg

Melting Point

112-115ºC(lit.)

Purity

95%

Density

1.329g/cm3

Appearance

White to Light yellow to Light red powder to crystal

Safety Information

Hazards

H315:
Causes skin irritation.
H319:
Causes serious eye irritation.

Precautionary Statement

P264:
Wash thoroughly after handling.
P280:
Wear protective gloves/protective clothing/eye protection/face protection.
P302+P352:
IF ON SKIN:
Wash with plenty of soap and water.
P332+P313:
If skin irritation occurs:
Get medical advice/attention.
P337+P313:
If eye irritation persists:
Get medical advice/attention.
P362+P364:
Take off contaminated clothing. [As modified by IV ATP].
And wash it before reuse. [Added by IV ATP].

Computed Properties

XLogP3

5.2

Hydrogen Bond Donor Count

Hydrogen Bond Acceptor Count

Rotatable Bond Count

Exact Mass

362.12176749 g/mol

Monoisotopic Mass

362.12176749 g/mol

Topological Polar Surface Area

52Å²

Heavy Atom Count

Formal Charge

Complexity

419

Isotope Atom Count

Defined Atom Stereocenter Count

Undefined Atom Stereocenter Count

Defined Bond Stereocenter Count

Undefined Bond Stereocenter Count

Covalently-Bonded Unit Count

Compound Is Canonicalized

Yes

Patents

Publication Number	Title	Priority Date
WO-2022030429-A1	Photosensitive resin composition, photosensitive resin film, patterned resin film, cured product, patterned cured product, method for producing electronic device, and electronic device	2020-08-05
WO-2022030447-A1	Fluorinated diamine or salt thereof, method for producing fluorinated diamine or salt thereof, polyamide, method for producing polyamide, polyamide solution, cyclized polyamide, method for producing cyclized polyamide, insulating material for high-frequency electronic component, method for producing insulating material for high-frequency electronic component, high-frequency electronic component, high-frequency appliance, and insulating material for producing high-frequency electronic component	2020-08-05
JP-2022019609-A	Photosensitive resin composition, manufacturing method of electronic device, manufacturing method of electronic device and photosensitive resin composition	2020-07-16
US-2022017673-A1	Dielectric Film Forming Compositions	2020-07-15
WO-2022015695-A1	Dielectric film forming compositions	2020-07-15
WO-2022009782-A1	Polybenzoxazole, polyamide, polyamide solution, insulation for high-frequency electronic component, high-frequency electronic component, high-frequency equipment, insulation material for producing high-frequency electronic component, method for producing polyamide, method for producing polybenzoxazole, method for producing insulation for high-frequency electronic component, and diamine or salt thereof	2020-07-10
JP-2021193411-A	Photosensitive resin composition, manufacturing method of electronic device and electronic device	2020-06-08
KR-20210138351-A	Polyimide film having low reflexibility	2020-05-12
WO-2021199798-A1	Inorganic substrate/engineering plastic film laminate equipped with protective film, laminate stack, method for storing laminate, and method for transporting laminate	2020-03-31
JP-2021161285-A	Polyimide adhesive	2020-03-31

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