4,4-METHYLENEBIS(2,6-DIISOPROPYL-N,N-DI METHYLANILINE, 97%

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Product Information

Molecular Formula
C29H46N2
Molecular Weight
422.69
Description
Applications: 4,4'-methylenebis(2,6-diisopropyl-N,N-dimethylaniline) is an organic chemical of research interest in the study of photosensitive plates from polymerizable aromatic amines.
Synonyms
4,4'-Methylenebis[N,N-dimethyl-2,6-bis(1-methylethyl)-benzenamine
IUPAC Name
4-[[4-(dimethylamino)-3,5-di(propan-2-yl)phenyl]methyl]-N,N-dimethyl-2,6-di(propan-2-yl)aniline
SMILES
CC(C)C1=CC(=CC(=C1N(C)C)C(C)C)CC2=CC(=C(C(=C2)C(C)C)N(C)C)C(C)C
InChI
InChI=1S/C29H46N2/c1-18(2)24-14-22(15-25(19(3)4)28(24)30(9)10)13-23-16-26(20(5)6)29(31(11)12)27(17-23)21(7)8/h14-21H,13H2,1-12H3
InChI Key
ZLLKEHZDBYULNW-UHFFFAOYSA-N
Melting Point
118-122 °C(lit.)

Computed Properties

XLogP3
8.6
Hydrogen Bond Donor Count
0
Hydrogen Bond Acceptor Count
2
Rotatable Bond Count
8
Exact Mass
422.366099476 g/mol
Monoisotopic Mass
422.366099476 g/mol
Topological Polar Surface Area
6.5Ų
Heavy Atom Count
31
Formal Charge
0
Complexity
439
Isotope Atom Count
0
Defined Atom Stereocenter Count
0
Undefined Atom Stereocenter Count
0
Defined Bond Stereocenter Count
0
Undefined Bond Stereocenter Count
0
Covalently-Bonded Unit Count
1
Compound Is Canonicalized
Yes

Patents

Publication Number Title Priority Date
JP-2018178009-A Adhesive composition for semiconductor device and adhesive tape for semiconductor device 2017-04-17
JP-6876499-B2 Adhesive composition for semiconductor devices and adhesive tape for semiconductor devices 2017-04-17
JP-2012237776-A Base proliferating agent and base-reactive resin composition containing the base proliferating agent 2011-05-09
JP-2012250969-A Carboxylic acid compound, base generator and photosensitive resin composition containing the base generator 2011-05-09
JP-5733618-B2 Base proliferating agent and base-reactive resin composition containing the base proliferating agent 2011-05-09
JP-5765851-B2 Carboxylic acid compound, base generator and photosensitive resin composition containing the base generator 2011-05-09
TW-200914492-A Method for forming porous polyamide acid particle 2007-09-20
TW-I355396-B Method for forming porous polyamic acid particles 2007-09-20
JP-5707622-B2 Photocurable composition 2007-08-09
JP-WO2009019979-A1 Photocurable composition 2007-08-09
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