Bisphenol A acetate propionate
Product Information
Molecular Formula
C20H22O4
Molecular Weight
326.4
Description
Propanioc acid, mixed diesters with acetic acid and bisphenol A• Hydrolytically resistant• Low melting point • Thermal stability• Hydrophobic• Toughener• Does not impede free radical cure• Well-suited for film adhesives and pre-applied adhesives
Synonyms
EC-326,Epoxy Curative
IUPAC Name
[4-[2-(4-acetyloxyphenyl)propan-2-yl]phenyl] propanoate
SMILES
CCC(=O)OC1=CC=C(C=C1)C(C)(C)C2=CC=C(C=C2)OC(=O)C
InChI
InChI=1S/C20H22O4/c1-5-19(22)24-18-12-8-16(9-13-18)20(3,4)15-6-10-17(11-7-15)23-14(2)21/h6-13H,5H2,1-4H3
InChI Key
VWMUCEDXVAQLNS-UHFFFAOYSA-N
Boiling Point
247 °C(lit.)
Melting Point
39-44 °C
Flash Point
>392 °F
Purity
97% ((as a mixture))
Refractive Index
n20/D 1.488 (lit.)
Safety Information
Hazards
H302 - H315 - H319 - H335 - H410
Precautionary Statement
P273 - P301 + P312 + P330 - P302 + P352 - P305 + P351 + P338
Computed Properties
XLogP3
4.7
Hydrogen Bond Donor Count
0
Hydrogen Bond Acceptor Count
4
Rotatable Bond Count
7
Exact Mass
326.15180918 g/mol
Monoisotopic Mass
326.15180918 g/mol
Topological Polar Surface Area
52.6Ų
Heavy Atom Count
24
Formal Charge
0
Complexity
427
Isotope Atom Count
0
Defined Atom Stereocenter Count
0
Undefined Atom Stereocenter Count
0
Defined Bond Stereocenter Count
0
Undefined Bond Stereocenter Count
0
Covalently-Bonded Unit Count
1
Compound Is Canonicalized
Yes
Patents
| Publication Number | Title | Priority Date |
|---|---|---|
| US-2012279697-A1 | Thermal interface material with phenyl ester | 2009-11-13 |
| WO-2011059942-A2 | Thermal interface material with phenyl ester | 2009-11-13 |
| US-2013199724-A1 | Curatives for epoxy compositions | 2009-10-09 |
| US-2010113643-A1 | Curatives for epoxy adhesive compositions | 2007-04-09 |
| US-2010249276-A1 | Curatives for epoxy compositions | 2007-04-09 |
| US-2013299747-A1 | Curatives for epoxy compositionsers | 2007-04-09 |
| US-8431655-B2 | Curatives for epoxy compositions | 2007-04-09 |
| WO-2008124797-A1 | Curatives for epoxy compositions | 2007-04-09 |
