α,α'-Bis(4-hydroxy-3,5-dimethylphenyl)-1,4-diisopropylbenzene
Product Information
Molecular Formula
C28H34O2
Molecular Weight
402.57
Description
α,α'-Bis(4-hydroxy-3,5-dimethylphenyl)-1,4-diisopropylbenzene is a potent compound widely utilized in the biomedical industry. With its remarkable pharmacological properties, it acts as an effective inhibitor for specific enzymes associated with chronic inflammatory diseases, such as rheumatoid arthritis and asthma. This product plays a vital role in providing targeted treatment for these conditions by modulating key pathways involved in their pathogenesis.
Synonyms
ALPHA,ALPHA'-BIS(4-HYDROXY-3,5-DIMETHYLPHENYL)-1,4-DIISOPROPYLBENZENE; 1,4-bis[2-(4-hydroxy-3,5-dimethylphenyl)-2-propyl]benzene; 4,4'-[1,4-phenylenebis(1-methylethylidene)]bis[2,6-dimethyl-Phenol; 4,4'-Bis(4-hydroxy-3,5-dimethylphenyl)-1,4-diisopropylbenze
IUPAC Name
4-[2-[4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]phenyl]propan-2-yl]-2,6-dimethylphenol
SMILES
CC1=CC(=CC(=C1O)C)C(C)(C)C2=CC=C(C=C2)C(C)(C)C3=CC(=C(C(=C3)C)O)C
InChI
InChI=1S/C28H34O2/c1-17-13-23(14-18(2)25(17)29)27(5,6)21-9-11-22(12-10-21)28(7,8)24-15-19(3)26(30)20(4)16-24/h9-16,29-30H,1-8H3
InChI Key
SIDYFHJPUCRHJY-UHFFFAOYSA-N
Melting Point
163 °C
Purity
>98.0%(GC)
Appearance
White to Almost white powder to crystal
Safety Information
Hazards
H315:
Causes skin irritation.
H319:
Causes serious eye irritation.
Causes skin irritation.
H319:
Causes serious eye irritation.
Precautionary Statement
P264:
Wash thoroughly after handling.
P280:
Wear protective gloves/protective clothing/eye protection/face protection.
P302+P352:
IF ON SKIN:
Wash with plenty of soap and water.
P332+P313:
If skin irritation occurs:
Get medical advice/attention.
P337+P313:
If eye irritation persists:
Get medical advice/attention.
P362+P364:
Take off contaminated clothing. [As modified by IV ATP].
And wash it before reuse. [Added by IV ATP].
Wash thoroughly after handling.
P280:
Wear protective gloves/protective clothing/eye protection/face protection.
P302+P352:
IF ON SKIN:
Wash with plenty of soap and water.
P332+P313:
If skin irritation occurs:
Get medical advice/attention.
P337+P313:
If eye irritation persists:
Get medical advice/attention.
P362+P364:
Take off contaminated clothing. [As modified by IV ATP].
And wash it before reuse. [Added by IV ATP].
Computed Properties
XLogP3
8.3
Hydrogen Bond Donor Count
2
Hydrogen Bond Acceptor Count
2
Rotatable Bond Count
4
Exact Mass
402.255880323 g/mol
Monoisotopic Mass
402.255880323 g/mol
Topological Polar Surface Area
40.5Ų
Heavy Atom Count
30
Formal Charge
0
Complexity
485
Isotope Atom Count
0
Defined Atom Stereocenter Count
0
Undefined Atom Stereocenter Count
0
Defined Bond Stereocenter Count
0
Undefined Bond Stereocenter Count
0
Covalently-Bonded Unit Count
1
Compound Is Canonicalized
Yes
Patents
| Publication Number | Title | Priority Date |
|---|---|---|
| WO-2022038893-A1 | Curable resin, curable resin composition, and cured product | 2020-08-19 |
| JP-2021181546-A | Modified polyphenylene ether, its production method, thermosetting composition, prepreg, and laminate. | 2020-05-20 |
| JP-2020200401-A | Resin composition and optical film using it | 2019-06-11 |
| US-2021171883-A1 | Antiviral wiper | 2018-08-29 |
| JP-2019206637-A | Vinyl benzyl ether resin, method for producing vinyl benzyl ether resin, curable resin composition, cured product of curable resin composition, and shield member | 2018-05-29 |
| TW-202003734-A | Resin composition, laminate, semiconductor wafer with resin composition layer, mounting substrate for semiconductor with resin composition layer, and semiconductor device | 2018-04-26 |
| TW-202003755-A | Resin composition, laminate, semiconductor wafer with resin composition layer, mounting board for semiconductor with resin composition layer, and semiconductor device | 2018-04-26 |
| WO-2019208604-A1 | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device | 2018-04-26 |
| WO-2019208614-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 2018-04-26 |
| CN-112005351-A | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device | 2018-04-26 |
