Tris(3,5-dimethylphenyl)phosphine
Product Information
Molecular Formula
C24H27P
Molecular Weight
346.44
Description
Catalyst for:• Cu / diphosphine-catalyzed asymmetric hydrogenation of heteroaromatic ketones and enones• Highly selective rhodium-catalyzed hydrogenation reactions• Classical versus kinetic resolution in preparation of privileged silicon-stereogenic silanaphthalenesUsed for kinetic resolution of donor-functionalized secondary alcohols via Cu-H-catalyzed stereoselective silylation by dehydrogenative Si-O coupling with Si-stereogenic silanesUsed for comparative studies of conformational rigidity of silicon-stereogenic silanes in asymmetric catalysis
Synonyms
tris(3,5-dimethylphenyl)-phosphin; TRIS(3,5-DIMETHYLPHENYL)PHOSPHINE; TRIS(3,5-XYLYL)PHOSPHINE; TRI(3,5-XYLYL)PHOSPHINE; Trisdimethylphenylphosphine; Tris(3,5-dimethylphenyl)phosphine,98%; TRIS(3,5-DIMETHYLPHENYL)PHOSPHINE, 97+%; Tri(3,5-dimethylphenyl)phosphine
IUPAC Name
tris(3,5-dimethylphenyl)phosphane
SMILES
CC1=CC(=CC(=C1)P(C2=CC(=CC(=C2)C)C)C3=CC(=CC(=C3)C)C)C
InChI
InChI=1S/C24H27P/c1-16-7-17(2)11-22(10-16)25(23-12-18(3)8-19(4)13-23)24-14-20(5)9-21(6)15-24/h7-15H,1-6H3
InChI Key
XRALRSQLQXKXKP-UHFFFAOYSA-N
Boiling Point
474.1°C at 760 mmHg
Melting Point
161-164°C
Flash Point
Not applicable
Purity
95%
Appearance
white to light yellow crystal powder
Safety Information
Hazards
H302
Computed Properties
XLogP3
6.8
Hydrogen Bond Donor Count
0
Hydrogen Bond Acceptor Count
0
Rotatable Bond Count
3
Exact Mass
346.185037859 g/mol
Monoisotopic Mass
346.185037859 g/mol
Topological Polar Surface Area
0Ų
Heavy Atom Count
25
Formal Charge
0
Complexity
327
Isotope Atom Count
0
Defined Atom Stereocenter Count
0
Undefined Atom Stereocenter Count
0
Defined Bond Stereocenter Count
0
Undefined Bond Stereocenter Count
0
Covalently-Bonded Unit Count
1
Compound Is Canonicalized
Yes
Patents
| Publication Number | Title | Priority Date |
|---|---|---|
| CN-114163771-A | Resin composition | 2020-09-11 |
| CN-114163772-A | Resin composition | 2020-09-11 |
| CN-114163801-A | Resin composition | 2020-09-11 |
| CN-114163802-A | Cured body | 2020-09-11 |
| CN-114173469-A | Method for manufacturing light reflection substrate | 2020-09-11 |
| JP-2022001628-A | Resin composition | 2020-06-22 |
| CN-113801406-A | Resin composition | 2020-06-12 |
| JP-2021195447-A | Resin composition | 2020-06-12 |
| KR-20210154751-A | Resin composition | 2020-06-12 |
| CN-113717495-A | Resin composition | 2020-05-26 |
