1,1,5,5-Tetraphenyltetramethyltrisiloxane
Product Information
Molecular Formula
C28H32O2Si3
Molecular Weight
484.82
Description
Thermal Silicone FluidHigh phenyl content fluids are utilized as heat-exchange fluids. dielectric coolants. impregnants for sintered metal bearing. and base oils for high temperature fluids. Low phenyl content fluids are utilized at lower temperatures than high phenylsilicones and find extended temperature service applications as lubricating oils for critical devices such as timers and systems involving rubber. plastic and aluminummating surfaces.1.1.5.5-Tetraphenyl-1.3.3.5-tetramethyltrisiloxanePhenylMethylsiloxane Oligomers - Diffusion FluidsViscosity. 25 °C: 35-40 cStViscosity. 99 °C:Pour-point. °C: -35Specific gravity: 1.07Refractive index: 1.556Surface tension: 37.3Molecular Weight: 485 g/mol
Synonyms
1,3,3,5-tetramethyl-1,1,5,5-tetraphenyl-trisiloxan; PHENYLMETHYLSILOXANE OLIGOMER; TETRAMETHYLTETRAPHENYLTRISILOXANE AND PENTA PHENYLTRIMETHYLTRISILOXANE; 1,3,3,5-TETRAMETHYL-1,1,5,5-TETRAPHENYLTRISILOXANE; 1,1,5,5-TETRAPHENYL-1,3,3,5-TETRAMETHYLTRISILOXANE;
IUPAC Name
dimethyl-bis[[methyl(diphenyl)silyl]oxy]silane
SMILES
C[Si](C)(O[Si](C)(C1=CC=CC=C1)C2=CC=CC=C2)O[Si](C)(C3=CC=CC=C3)C4=CC=CC=C4
InChI
InChI=1S/C28H32O2Si3/c1-31(2,29-32(3,25-17-9-5-10-18-25)26-19-11-6-12-20-26)30-33(4,27-21-13-7-14-22-27)28-23-15-8-16-24-28/h5-24H,1-4H3
InChI Key
YFCVAZGXPLMNDG-UHFFFAOYSA-N
Boiling Point
215°C (0.5 mmHg)
Melting Point
-25°C
Flash Point
221°C (430°F)
Purity
95%
Density
1.07
Solubility
water, 1.553e-006 mg/L @ 25 °C (est)
Refractive Index
n20/D 1.559
Computed Properties
Hydrogen Bond Donor Count
0
Hydrogen Bond Acceptor Count
2
Rotatable Bond Count
8
Exact Mass
484.17100986 g/mol
Monoisotopic Mass
484.17100986 g/mol
Topological Polar Surface Area
18.5Ų
Heavy Atom Count
33
Formal Charge
0
Complexity
500
Isotope Atom Count
0
Defined Atom Stereocenter Count
0
Undefined Atom Stereocenter Count
0
Defined Bond Stereocenter Count
0
Undefined Bond Stereocenter Count
0
Covalently-Bonded Unit Count
1
Compound Is Canonicalized
Yes
Patents
| Publication Number | Title | Priority Date |
|---|---|---|
| WO-2021235476-A1 | Surface treatment method for semiconductor substrate, and surface treatment agent composition | 2020-05-21 |
| WO-2021235479-A1 | Surface treatment method for semiconductor substrates, and surface treatment agent composition | 2020-05-21 |
| CN-111269256-A | Synthesis method of diffusion pump oil intermediate trimethyl-R-tetraethoxytrisiloxane | 2020-02-17 |
| TW-202033982-A | Low melting point ionic liquids for infra-red liquid lens design | 2019-02-01 |
| CN-113661161-A | Low-melting-point ionic liquid for infrared liquid lens design | 2019-02-01 |
| TW-202030490-A | Particle connecting body, connecting material, connecting structure, conduction inspection member and conduction inspection device | 2018-11-15 |
| US-2020035494-A1 | Surface Treatment Compositions and Methods | 2018-07-30 |
| WO-2020028214-A1 | Surface treatment compositions and methods | 2018-07-30 |
| TW-202016280-A | Surface treatment composition and method | 2018-07-30 |
| CN-112513192-A | Surface treatment composition and method | 2018-07-30 |
