Polydimethylsiloxane, diaminopropyl terminated
Product Information
Molecular Formula
H2N(CH2)3Si(CH3)2O[Si(CH3)2O]nSi(CH3)2(CH2)3NH2
Molecular Weight
322.67
Description
Polydimethylsiloxane, diaminopropyl terminated is a multifaceted compound extensively utilized in the biomedical sector. Its application spans across diverse drug preparations and medical apparatus. This invaluable substance assumes a pivotal function in the advancement of precision drug distribution networks, particularly for ailments encompassing cancer and neurological disorders.
Synonyms
PDMS
IUPAC Name
3-[[[3-aminopropyl(dimethyl)silyl]oxy-dimethylsilyl]oxy-dimethylsilyl]propan-1-amine
SMILES
C[Si](C)=O.C[Si](C)(O)CCCN
InChI
InChI=1S/C12H34N2O2Si3/c1-17(2,11-7-9-13)15-19(5,6)16-18(3,4)12-8-10-14/h7-14H2,1-6H3
InChI Key
ZWRBLCDTKAWRHT-UHFFFAOYSA-N
Melting Point
None °C
Flash Point
None °C (None)
Density
0.98 g/mL at 25 °C (lit.)
Refractive Index
1.41
Viscosity
cSt 20-30
Computed Properties
Hydrogen Bond Donor Count
2
Hydrogen Bond Acceptor Count
4
Rotatable Bond Count
10
Exact Mass
322.19280793 g/mol
Monoisotopic Mass
322.19280793 g/mol
Topological Polar Surface Area
70.5Ų
Heavy Atom Count
19
Formal Charge
0
Complexity
237
Isotope Atom Count
0
Defined Atom Stereocenter Count
0
Undefined Atom Stereocenter Count
0
Defined Bond Stereocenter Count
0
Undefined Bond Stereocenter Count
0
Covalently-Bonded Unit Count
1
Compound Is Canonicalized
Yes
Patents
| Publication Number | Title | Priority Date |
|---|---|---|
| CN-113698575-A | Siloxane Schiff base structure-based high-impact-resistance remodelable flame-retardant epoxy resin and preparation method thereof | 2021-09-02 |
| JP-2021094734-A | A method for manufacturing a laminated film, a wiring board, and a method for manufacturing a semiconductor device. | 2019-12-16 |
| WO-2021065704-A1 | Thermosetting resin composition, thermosetting resin sheet, electronic component, and electronic device | 2019-10-01 |
| TW-202122494-A | Thermosetting resin composition, thermosetting resin sheet, electronic part, and electronic device | 2019-10-01 |
| WO-2021039442-A1 | Polyimide resin composition, polyimide varnish, and polyimide film | 2019-08-28 |
| TW-202115156-A | Polyimide resin composition, polyimide varnish, and polyimide film | 2019-08-28 |
| WO-2021029320-A1 | Film-forming material for lithography, composition for forming film for lithography, underlayer film for lithography, and method for forming pattern | 2019-08-09 |
| US-2022049122-A1 | Method for the prevention of mist formation in a device comprising rolls during the coating of flexible supports with a cross-linkable liquid silicone composition | 2018-12-20 |
| WO-2020121949-A1 | Polyimide resin composition and polyimide film | 2018-12-13 |
| KR-20210102216-A | Polyimide resin composition and polyimide film | 2018-12-13 |
