3,3-(Ethylenedioxy)diphenol
Product Information
Molecular Formula
C14H14O4
Molecular Weight
246.26
Description
Within the realm of pharmacology, 3,3-(Ethylenedioxy)diphenol plays a pivotal role in formulating pharmaceutical agents specifically tailored for countering the virulent onslaught of afflictions such as HIV/AIDS and herpes.
Synonyms
3,3'-Ethylenedioxydiphenol; Phenol, 3,3'-[1,2-ethanediylbis(oxy)]bis-; 1,2-Bis(3-hydroxyphenoxy)ethane; 3,3'-(Ethane-1,2-diylbis(oxy))diphenol; 3-[2-(3-hydroxyphenoxy)ethoxy]phenol; 3,3'-[ethane-1,2-diylbis(oxy)]diphenol; Phenol, 3,3'-(1,2-ethanediylbis(oxy))bis-; Bisresorcine ethylene ether; 3,3-(ethylenedioxy)diphenol; 3,3'-(1,2-Ethanediylbis(oxy))bisphenol; Ethylene Glycol Bis(3-hydroxyphenyl) Ether; 3,3'-(Ethylenedioxy)diphenol, 85%, technical grade;
IUPAC Name
3-[2-(3-hydroxyphenoxy)ethoxy]phenol
SMILES
C1=CC(=CC(=C1)OCCOC2=CC=CC(=C2)O)O
InChI
InChI=1S/C14H14O4/c15-11-3-1-5-13(9-11)17-7-8-18-14-6-2-4-12(16)10-14/h1-6,9-10,15-16H,7-8H2
InChI Key
DBFHCPVZZSVFJL-UHFFFAOYSA-N
Boiling Point
466.6°C at 760 mmHg
Melting Point
157-160°C(lit.)
Flash Point
Not applicable
Purity
95%
Density
1.261g/cm3
Safety Information
Hazards
H315 - H319 - H335
Precautionary Statement
P302 + P352 - P305 + P351 + P338
Computed Properties
XLogP3
3.1
Hydrogen Bond Donor Count
2
Hydrogen Bond Acceptor Count
4
Rotatable Bond Count
5
Exact Mass
246.08920892 g/mol
Monoisotopic Mass
246.08920892 g/mol
Topological Polar Surface Area
58.9Ų
Heavy Atom Count
18
Formal Charge
0
Complexity
210
Isotope Atom Count
0
Defined Atom Stereocenter Count
0
Undefined Atom Stereocenter Count
0
Defined Bond Stereocenter Count
0
Undefined Bond Stereocenter Count
0
Covalently-Bonded Unit Count
1
Compound Is Canonicalized
Yes
Patents
| Publication Number | Title | Priority Date |
|---|---|---|
| JP-2021063946-A | Method for manufacturing photosensitive resin composition and electronic device | 2019-10-16 |
| JP-2021028926-A | Manufacturing method of electronic device | 2019-08-09 |
| DE-102019116397-A1 | Optochemical sensor, sensor cap and method for producing an analyte-sensitive layer | 2019-06-17 |
| JP-2020071280-A | Photosensitive resin composition and method for manufacturing electronic device | 2018-10-30 |
| JP-2020019864-A | Photosensitive adhesive composition and structure | 2018-07-31 |
| JP-2019204818-A | Electronic equipment | 2018-05-21 |
| JP-2019200378-A | Photosensitive resin composition, structure, electronic device, and method for producing the same | 2018-05-18 |
| JP-2019113690-A | Photosensitive adhesive composition and structure | 2017-12-22 |
| JP-2019109425-A | Negative photosensitive resin composition for forming permanent film, cured film of the composition, and electric / electronic device provided with the cured film | 2017-12-20 |
| JP-2018173471-A | Photosensitive resin composition and semiconductor device | 2017-03-31 |
