Bisphenol F, mixture of acetates and propionates

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Product Information

Molecular Formula:
C19H22O4
Molecular Weight:
314.4
Description
Epoxy curative with good thermal properties.• Stable• Low viscosity• Does not impede free radical cure• Thermoset adhesives• Curative for epoxy/(meth) acrylate hybrids• Hybrid epoxy/free radical thermosets
Synonyms
4,4'-Methylenebisphenol, bis(mixed acetates and propionates),EC-298
IUPAC Name
(4-ethylphenyl) acetatephenyl propanoate
Canonical SMILES
CCC1=CC=C(C=C1)OC(=O)C.CCC(=O)OC1=CC=CC=C1
InChI
InChI=1S/C10H12O2.C9H10O2/c1-3-9-4-6-10(7-5-9)12-8(2)111-2-9(10)11-8-6-4-3-5-7-8/h4-7H,3H2,1-2H33-7H,2H2,1H3
InChI Key
YSLOPJZKQCDNMF-UHFFFAOYSA-N
Boiling Point
247 °C(lit.)
Flash Point
>230 °F
Purity
97% ((as a mixture))
Density
1.143 g/mL at 25 °C
Storage
2-8°C
Refractive Index
n20/D 1.549

Safety Information

Hazards
H302 - H319
Precautionary Statement
P305 + P351 + P338

Computed Properties

Hydrogen Bond Donor Count
0
Hydrogen Bond Acceptor Count
4
Rotatable Bond Count
6
Exact Mass
314.15180918 g/mol
Monoisotopic Mass
314.15180918 g/mol
Topological Polar Surface Area
52.6Ų
Heavy Atom Count
23
Formal Charge
0
Complexity
271
Isotope Atom Count
0
Defined Atom Stereocenter Count
0
Undefined Atom Stereocenter Count
0
Defined Bond Stereocenter Count
0
Undefined Bond Stereocenter Count
0
Covalently-Bonded Unit Count
2
Compound Is Canonicalized
Yes

Patents

Publication Number Title Priority Date
US-2013199724-A1 Curatives for epoxy compositions 2009-10-09
US-2010249276-A1 Curatives for epoxy compositions 2007-04-09
US-2013299747-A1 Curatives for epoxy compositionsers 2007-04-09
US-8431655-B2 Curatives for epoxy compositions 2007-04-09
The molarity calculator equation

Mass (g) = Concentration (mol/L) × Volume (L) × Molecular Weight (g/mol)

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The dilution calculator equation

Concentration (start) × Volume (start) = Concentration (final) × Volume (final)

This equation is commonly abbreviated as: C1V1 = C2V2

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44-20-3980-8385
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