Bisphenol F, mixture of acetates and propionates
Product Information
Molecular Formula
C19H22O4
Molecular Weight
314.4
Description
Epoxy curative with good thermal properties.• Stable• Low viscosity• Does not impede free radical cure• Thermoset adhesives• Curative for epoxy/(meth) acrylate hybrids• Hybrid epoxy/free radical thermosets
Synonyms
4,4'-Methylenebisphenol, bis(mixed acetates and propionates),EC-298
IUPAC Name
(4-ethylphenyl) acetatephenyl propanoate
SMILES
CCC1=CC=C(C=C1)OC(=O)C.CCC(=O)OC1=CC=CC=C1
InChI
InChI=1S/C10H12O2.C9H10O2/c1-3-9-4-6-10(7-5-9)12-8(2)111-2-9(10)11-8-6-4-3-5-7-8/h4-7H,3H2,1-2H33-7H,2H2,1H3
InChI Key
YSLOPJZKQCDNMF-UHFFFAOYSA-N
Boiling Point
247 °C(lit.)
Flash Point
>230 °F
Purity
97% ((as a mixture))
Density
1.143 g/mL at 25 °C
Storage
2-8°C
Refractive Index
n20/D 1.549
Safety Information
Hazards
H302 - H319
Precautionary Statement
P305 + P351 + P338
Computed Properties
Hydrogen Bond Donor Count
0
Hydrogen Bond Acceptor Count
4
Rotatable Bond Count
6
Exact Mass
314.15180918 g/mol
Monoisotopic Mass
314.15180918 g/mol
Topological Polar Surface Area
52.6Ų
Heavy Atom Count
23
Formal Charge
0
Complexity
271
Isotope Atom Count
0
Defined Atom Stereocenter Count
0
Undefined Atom Stereocenter Count
0
Defined Bond Stereocenter Count
0
Undefined Bond Stereocenter Count
0
Covalently-Bonded Unit Count
2
Compound Is Canonicalized
Yes
Patents
| Publication Number | Title | Priority Date |
|---|---|---|
| US-2013199724-A1 | Curatives for epoxy compositions | 2009-10-09 |
| US-2010249276-A1 | Curatives for epoxy compositions | 2007-04-09 |
| US-2013299747-A1 | Curatives for epoxy compositionsers | 2007-04-09 |
| US-8431655-B2 | Curatives for epoxy compositions | 2007-04-09 |
