(3-ETHYL 3-OXETANYL) METHYL METHACRYLATE
Product Information
Molecular Formula
C10H16O3
Molecular Weight
184.24
Description
(3-Ethyl 3-Oxetanyl) Methyl Methacrylate is a specialized compound in biomedicine, primarily used to enhance drug delivery systems. Its application in polymer drug delivery contributes to research on drug encapsulation technology.
Synonyms
Methacrylic Acid (3-Ethyloxetan-3-yl)methyl Ester (stabilized with MEHQ)
IUPAC Name
(3-ethyloxetan-3-yl)methyl 2-methylprop-2-enoate
SMILES
CCC1(COC1)COC(=O)C(=C)C
InChI
InChI=1S/C10H16O3/c1-4-10(5-12-6-10)7-13-9(11)8(2)3/h2,4-7H2,1,3H3
InChI Key
RSHKWPIEJYAPCL-UHFFFAOYSA-N
Flash Point
93 °C
Purity
>98.0%(GC)
Appearance
Colorless to Light yellow clear liquid
Computed Properties
XLogP3
1.7
Hydrogen Bond Donor Count
0
Hydrogen Bond Acceptor Count
3
Rotatable Bond Count
5
Exact Mass
184.109944368 g/mol
Monoisotopic Mass
184.109944368 g/mol
Topological Polar Surface Area
35.5Ų
Heavy Atom Count
13
Formal Charge
0
Complexity
216
Isotope Atom Count
0
Defined Atom Stereocenter Count
0
Undefined Atom Stereocenter Count
0
Defined Bond Stereocenter Count
0
Undefined Bond Stereocenter Count
0
Covalently-Bonded Unit Count
1
Compound Is Canonicalized
Yes
Patents
| Publication Number | Title | Priority Date |
|---|---|---|
| CN-113999618-A | Low-odor and low-irritation dual-curing adhesive and preparation method thereof | 2021-11-22 |
| JP-2022009139-A | Radiation-sensitive resin composition | 2021-10-14 |
| CN-114149530-A | Alkali-soluble polymer for preparing LDI dry film and preparation method thereof | 2021-09-23 |
| CN-113600808-A | Metal paste for photocuring 3D printing and preparation method thereof | 2021-08-04 |
| KR-102352657-B1 | Antireflection Film and Organic Light Emitting Display Device | 2021-07-19 |
| CN-113504704-A | Photosensitive resin composition and color filter formed thereby | 2021-01-20 |
| JP-2021063999-A | Colored photosensitive resin composition | 2021-01-04 |
| CN-112300375-A | Preparation method of waterborne light-cured epoxy acrylic resin | 2020-11-06 |
| US-2022077099-A1 | Composition for conductive adhesive, semiconductor package comprising cured product thereof, and method of manufacturing semiconductor package using the same | 2020-09-09 |
| WO-2022054612-A1 | Colored resin composition | 2020-09-08 |
